Assembly

6 complete SMT Hanwa (Samsung) lines with Pick & Place technology, laser marking of PCB/FPCs 

SMT: 1.500.000 components per shift (optimum is 450.000 CPH)

THT: 25.000 components per shift

Controlled storage of MSD components

Assembly of big PCBs to the size of 609×508 mm
min. pitch 0,5 mm for QFP a 1 mm for BGA 3D

ESD protection, temperature and humidity control 

Control of paste printing with 3D SPI with a closed loop for screen printing